발행물
컨퍼런스
2017 International Conference on Planarization/CMP Technology
2017
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Characterization of incoming PVA brush by an ultrasonication break-in process
Novel Method for Nano-Surface Analysis of Cu CMP Chemicals by AFM and Microfluidics Chip System
21st Interanational Symposium on Chemical-Mechanical Planarization
Qualitative and Quantitative Characterization of Cu Complex Layer in CMP
2017년도 한국재료학회 춘계학술대회
EUV 리소그래피 마스크 표면에서의 오염입자의 흡착 및 제거 영향에 관한 연구
Investigation of Particle Contamination and Removal Mechanism with Corrosion Inhibitors for Cu CMP Application