발행물
컨퍼런스
228th ElectroChemical Society Meeting
2015
,
Prevention of Metal Contamination in Sub 50nm SC1 Cleaning Process
Advanced Metallization Conference 2015 25th Asian Session
Effect of pH and Polisher's Conditions on Cu-BTA Complex Formation during Cu CMP Application
2015 International Workshop on EUV Lithography
Critical defect size on the extreme ultraviolet (EUV) mask and cleaning process for its removal
The 59th Technical Meeting of Korea CMPUGM
Effect of Pump-Induced particle agglomeration due to Various Pump type
2015년도 한국재료학회 춘계학술대회 및 제 28회 신소재 심포지엄
Cu CMP 공정 중 Cu 표면에 형성되는 Cu-BTA Complex에 관한 특성/