발행물
컨퍼런스
2015년도 한국재료학회 추계학술대회 및 제 29회 신소재 심포지엄
2015
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Characterization of Cu-BTA complex formation by Cu CMP and pH condition
The 60th Technical Meeting of Korea CMPUGM
Evaluation of various composition Cu-resin plates in sapphire DMP (Diamond Mechanical Polishing) process
2015 International Union of Materials Research Societies(IUMRS)
Fabrication of Bumping Mask Using Electro-Chemical Reaction on Stainless Steel
228th ElectroChemical Society Meeting
Fabrication of Bumping Mask for Flip-Chip Process on Stainless Steel Using Through Mask Electrochemical Micro Machining(TMEMM)
Submicron Particle Removal During FPD Oxide TFT Process