발행물
컨퍼런스
2016 Material Research Society
2016
,
Relationship between Surface Damage and Particle Removal on Si Wafer during SC1 Cleaning Process for Si Wafer Manufacturing
CSTIC 2016 - China Semiconductor Technology International Conference 2016
Adsorption and removal of BTA during Cu CMP and post Cu CMP cleaning
2015년도 한국재료학회 추계학술대회 및 제 29회 신소재 심포지엄
2015
Effect of 30 nm particle contaminant on the extreme ultraviolet (EUV) mask and megasonic cleaning process for its removal
The research on the oxide etching mechanisms using NF3/H2O plasma gas
Study for minimization of edge effect during bumping mask fabrication by TMEMM process