발행물
컨퍼런스
Semicon korea 2003
2003
,
Post CMP cleaning: from fundamentals to future direction
The 1st international surface cleaning workshop
2002
A new physical dry cleaning technique: Laser Shock cleaning
Nano particle adhesion and removal
The adhesion and removal of silica particles on Cu substrates during Cu CMP
2002 한국재료학회 추계 학술발표
CU CMP Slurry의 첨가제에 따른 특성 평가