발행물
컨퍼런스
2004 MRS Spring Meeting
2004
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Nanometer thick fluorocarbon films for nano imprinting
Chemical Mechanical Planarization of Ruthenium Thin Film
Reactivity and Removal Mechanism of Copper with Various Orgainc Additives in Copper CMP Slurry
2004 AVS 5th International Conference on Microelectronics and Interfaces
The Removal of Nanoparticles from Submicron Trenches
Effect of Slurry Chemistry on Electrochemical Friction Behavior During Cu CMP