발행물
컨퍼런스
춘계 한국재료학회 학술대회
2001
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The Effects of Additives in Cu CMP Slurry on Polishing
Characterization of Perfluorpolymer Thin Film Grown in CH2F2 Plasma
The Electrochemical Society Fall Symposium
2000
Effect of Organic Acids in Slurry on Cu CMP
한국재료학회 추계 학술대회
Study of Interaction between slurry and substrates using Atomic Force Microscopy of interest to post CMP cleaning
한국재료학회 추계 학술 대회
A study on the effect of Ceria Particles in CMP Process