발행물
컨퍼런스
2002년도 한국재료학회 춘계 학술발표
2002
,
대기중에서 어닐링한 불화유기 박막의 나노트라이볼러지 특성 평가
INTERNATIONAL SYMPOSIUM OF WAFER CLEANING TECHNOLOGY
2001
EFFECT OF H2O2 AND IPA ADDITION IN DILUTE HF SOLUTIONS ON SURFACE ETHCING AND PARTICLE REMOVAL EFFICIENCY
International Symposium of Interconnect and Metalization
The Effect of Additives in Slurry on Copper CMP Slurry
International Symposium of Wafer Cleaning Technology
A new Approach for Study of Particle Adhesion and Removal Relevant to Post CMP Cleaning
춘계 한국재료학회 학술대회
The Characterization of Re-Used Oxide Slurry CMP Slurry Using Filter